AI Applications in Semiconductor Packaging Course Program

As semiconductor packaging grows more complex, traditional reliability methods are reaching their limits. While AI offers transformative opportunities for performance prediction and failure analysis, many professionals lack the knowledge to implement these advanced techniques.

This training examines how AI is revolutionizing semiconductor packaging reliability, comparing traditional methods with advanced techniques for performance prediction, failure analysis, and lifecycle optimization.

AI Applications in Semiconductor Packaging is a two-hour course program that equips learners with the ability to:

• Compare traditional and AI-driven approaches to semiconductor packaging reliability, gaining insight into how artificial intelligence transforms performance prediction and failure analysis.
• Understanding key categories of AI, including machine learning (ML), deep learning, and generative AI, with distinctions between supervised, unsupervised, and generative models.
• Explore neural networks for Semiconductor Packaging, specifically their components, including activation functions and neuron models, through analogies to human cognition and decision-making.
• Discover select AI/ML techniques, such as Support Vector Machines, K-means clustering, Self-Organizing Maps, and Long-Short-Term Memory networks, and how they apply to packaging reliability.
• Apply AI methods to real-world challenges in Semiconductor Packaging, including anomaly detection, machine state assessment, digital twin modeling, and forecasting the timing of future failures.

Who will this benefit?

• Semiconductor Packaging Engineers
• AI and ML Engineers and Data Scientists
• Systems Engineers
• Reliability Engineers
• Sustainability Leads in Electronics Manufacturing
• Quality Assurance Specialists
• Innovation Leads and CTOs
• Academic Researchers and Graduate Students

Instructor:
Dr. Pradeep Lall, IEEE Fellow and MacFarlane Endowed Distinguished Professor at Auburn University, is a globally recognized leader in electronics packaging and reliability. As Director of the Auburn University Electronics Packaging Research Institute, he brings deep expertise shaped by his prior work at Motorola, along with over 1,000 published journal and conference papers, two books, and 15 chapters. He holds a Ph.D. in Mechanical Engineering from the University of Maryland and an MBA from Northwestern University, and has earned more than 50 best-paper awards, as well as major honors from IEEE, ASME, SMTA, SEMI, and NSF, for his groundbreaking contributions to electronics manufacturing and design.